Model

X-Reflow306 LF-ACH

Reflow area

12"x12"x3.5" (305x305x90 mm)

Temperature range

50°C to 360°C

Number of Zones

Purging, to push oxygen out + variable, three to five zones, set by the operator for each program. Last zone is a cooling zone. So, the oven can have 3 zones or 5 zones.

Heaters

2 Heaters (Front and Rear) 3.45kW (230V) and 3.45KW (208V) - 

Max. PCB size

12"x12" (305x305 mm)

Supply Requirements

30 amps, 230V 50/60 Hz (Max power consumption: 6.9 kW)

Cooling Cycle

Last (Fifth) Zone

Monitoring Window Size

7.8"x7.8" (200×200 mm)

Nitrogen Connection

Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi)

Size

L=28"xW=21"xH=15.4"
(L=711mm x W=530mm x H=390mm)

Weight (unpacked)

145 lbs. (~68 kg)

Computer profile control

Allows pre-programming, storage and recall of up to 255 programs

Communication with PC

RS485 port (XKAR X485-USB converter required to connect to PC USB port)

Advanced Features

• Display of the actual temperature/time numerically or as a graph and full indication of set functions and process parameters along with their values in the Process Window.
• Independent off set for the 2 heaters, (useful when processing unevenly loaded boards).
• RS-485 port for downloading firmware upgrades from a PC and monitoring air and two additional “K” Thermocouples during reflow process. (X-KAR R485-USB Converter is needed for connection to a PC and X306 Oven Monitor Software for monitoring and displaying on a PC real temperature during the heating cycle. X-KAR XTC-Profiler (Eight TC inputs) is also recommended for multi-point monitoring.
• Ready to solder in Nitrogen environment and to connect Residual O2 Monitor.
• Means to monitor the process in progress (besides the on-board LCD display)
• Power at Max Mode, which allows for pre-setting a pre-reflow temperature of the heated object and a maximum temperature of this object by means of control of the heating by the “K” thermocouple attached to the heated object and the TC-B socket at the back of the unit.