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- MiniOven for Re-balling and small boards
MiniOven for Re-balling and small boards
The MiniOven was designed for Re-Balling and soldering the boards up to size 6”x 4.7"
There are 2 models of this MiniOven: X-106 MiniOven – basic for heating and
Model X-106 AC which incorporates fast cooling to solidify molten solder in 60 seconds or less.
The cooling feature is unique to X-KAR Brand and helps reliability of soldered connections.
The X-106 MiniOven was designed primarily for even, 100 % convection fast heating during soldering or re-balling. It provides full profiling, nitrogen environment if needed and the exceptionally accurate process control. It has a choice of the operating mode
bd-t (object or board temperature control). In this mode the oven will deliver hot air or nitrogen to achieve desired temperatures of the surface where the external control thermocouple is attached.
TECHNICAL SPECIFICATIONS:
|
Input Voltages |
220-240V AC 50/60 Hz or 110-120V AC 50/60 Hz |
|
Power Consumption |
1790W |
|
Fuse |
8A for 220-240V, 16A for 110-120V |
|
Heater Control |
PID, Closed-Loop Thermocouple sensor feedback |
|
Reflow area |
6.3”x4.7”x1.57” (160x120x40mm) |
|
Temperature range |
86 ºF – 662 ºF (30 ºC – 350 ºC) |
|
Temperature Zones |
Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones |
|
Heaters |
2 Heaters (Front and Rear) 900W each |
|
Max. PCB size |
160 x 120 mm (6” x 4.7”) |
|
Communication with PC |
RS485 port ( XKAR X485-USB converter required to connect to PC USB port) |
|
Weight |
8kg (17.7 lbs.) |
|
System dimensions |
17.3” x 8.8” x 8.3” (440mm x 225mm x 210mm) |
|
Packaged weight |
22.1 lbs. (10kg) |