Bokar International Bokar Internatinoal

Product range

USA

Quick Search


Products > X-KAR Brand > SMT Assembly Equipment > XMP-300 Series > XMP-302D

Logo X-KARXMP-302D Manual Pick and Place System
with Digital Dispenser For SMT Low Volume Assembly

Introduction

XMP-302D Pick, Paste and Place System was designed to allow the user to conveniently control the placement of the SMT components and the deposition of the solder paste on printed circuit boards. It allows the board to be placed close to the operator and an exchange of feeders for a second, optional bulk component tray loader. It comes from the factory equipped with the feeder base, six feeders, one XL-6/5D tray loader (with 6 single compartment and five, 2 compartment loose component trays) and XNS-1 needle/cup set.

CE Mark

Click to enlarge image

Features:

Note: When using dispenser air filter on the supply line is needed.

System includes:

Technical Specifications

Power Source 110-120 V, 220-240 V AC
Air pressure (shop air) Max 90 psi (0,7 Mpa)
Maximum placement area on the PCB 14" x 12" (360 x 305 mm)
The board can be turned around to place components
on remaining 14"x12". (Total area of 14"x24")
Quantity of feeders: Max 20 of 8 mm feeders XPT-8
Loose component tray loaders One, standard (max 2 simultaneously)
Vacuum Source High efficiency diaphragm pump
Dimensions 26.4” x 28.7”x 12.2” (670mm x 730mm x 310 mm)
Weight 55 lb (25 kg)
Shipping package weight
(Two packages)
27.2”x 27.6” x 7.1” (690mm x 700mm x 180mm) / 36 Ib (18 kg)
27.2” 18.1” x 12.8” (690mm x 460mm x 325mm) / 29 Ib (15 kg)

Optional accessories

  |  Print page  |  How to order
Bokar International is committed to continuing development of new products and improvements to existing products.
Specifications are subject to change without notice.