Products > X-KAR Brand > SMT Assembly Equipment > X-REFLOW305 Series
X-REFLOW305 HT-LF Full Convection,
Bench Top, Batch oven with Nitrogen Connections
Especially designed for LEAD FREE Soldering
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High performance, inexpensive reflow batch oven for use
in small lot production and laboratory simulation tests.
The X-REFLOW is a high performance reflow batch oven designed
for reflow simulation, heat-resistant testing and small lot
production.
With its large back light LCD display the setting of the
temperature and time or the operation, can be easily checked by
numerical value or graph.
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FEATURES
- HIGH OPERATING TEMPERATURE for LEAD FREE SOLDERING
Higher than other ovens max. operating temperature 350 °C (662 °F)
and better, stronger materials to assure good performance when
soldering with lead free alloys
- HIGH PERFORMANCE, INEXPENSIVE
The
X-REFLOW305 HT-LF is an inexpensive high performance production
reflow batch oven. This unit has several unique features, which enhance
operation and provide the use with every possible aid.
- SMALL DESKTOP SIZE
It has a small foot print
and weights only 43kg. Conventional ovens are large in size, but the
X-REFLOW305 HT-LF can fit on top of one desk in a small room.
- LARGE GLASS VIEWING WINDOW
The large glass
viewing window 280x280 mm allows the inside reflow condition to be
checked easily. Users can see the oven's inside directly, check and
photograph the detail soldering condition by using a microscope, a
small CCD camera.
- LARGE BACK LIGHT LCD DISPLAY WITH DIGITAL AND GRAPHIC
PROFILE INFORMATION
The large back light LCD display allows
easy inputting and checking of the profile. One button can change the
operation temperature profile on the graph display and allows checking
of the operation conditions at a glance. Depending on the working area
the LCD display brightness can be adjusted by the contrast adjustment
knob making is easy to see.
- CAPACITY TO STORE UP TO 255 PROFILES
The four
operation processes, preheat 1-3 and reflow, temperature and time are
set separately, allowing up to 255 profiles to be stored. To adapt to
the PCB size and mounting density, control temperature of the front and
back hot wind output opening can be adjusted. The reflow of multi layer
PCBs can be done for various small lot production.
- TIME ZONE LED (OPERATION LAMP)
The front side
time zone LEDs allow operation to be checked at a glance.
- N2 PORT
To decrease the oxidation of leads and
pads during soldering, compressed N2 gas source can be connected to the
oven to replace the air (oxygen).
- MANAGEMENT KEY
This oven has a management key.
If this key is not used, the oven cannot be operated.
Technical Specifications
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X-REFLOW305 HT-LF
High
Temperature and Lead Free
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| Reflow area |
12" x 12" x 1.75"
(305x305x45 mm)
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| Minimum cooling temperature |
150°C
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| Maximum temperature setting |
350°C
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| Heaters |
2 Heaters x 2,4kW Each
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| Max. PCB size |
12" x12" (305x305 mm)
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| Max current draw |
21 A,
230V 50/60 Hz
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| Size |
L=480mm x W=711mm x H=200mm
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| Weight |
88 lbs. (40 kg)
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| Computer profile control |
Allows creation, storage and recall of up to
255
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